This handbook will provide engineers with the principles, applications, and solutions needed to design and manage semiconductor manufacturing operations. Consolidating the many complex fields of semiconductor fundamentals and manufacturing into one volume by deploying a team of world class specialists, it allows the quick look up of specific manufacturing reference data across many subdisciplines.
Table of contents
PART 1: Semiconductor Fundamentals and Basic MaterialsBOARD OF REVIEWERSCONTRIBUTORSPREFACEACKNOWLEDGMENTSChapter 1: How Semiconductor Chips Are Made - Hwaiyu Geng, Lin ZhouChapter 2: IC Design - Ilsun ParkChapter 3: Silicon Substrates for Semiconductor Manufacturing - K.V. RaviChapter 4: Copper, Low-k Dielectrics, and Their Reliability - Hazara S. Rathore, Kaushik ChandaChapter 5: Fundamentals-Silicide Formation on Si - L.P. Ren, King N. TuChapter 6: Plasma Process Control - David J. CoumouChapter 7: Vacuum Technology - Peter BiltoftChapter 8: Photomask - Charles HowardPART 2: Wafer ProcessingChapter 9: Microlithography - Chris A. MackChapter 10: Ion Implantation and Rapid Thermal Processing - Michael GrafChapter 11: Wet Etching - Peng ZhangChapter 12: Plasma Etching - Shouliang LaiChapter 13: Physical Vapor Deposition - Florian SolzbacherChapter 14: Chemical Vapor Deposition - Edward J. McInerneyChapter 15: Epitaxy - Jamal Ramdani, Giovanni VaccariChapter 16: ECD Fundamentals - Tom Ritzdorf, John KlocksChapter 17: Chemical Mechanical Planarization - Timothy S. DyerChapter 18: Wet Cleaning - Andrew MachamerPart 3: Final ManufacturingChapter 19: Inspection, Measurement, and Test - Donald W. BlairChapter 20: Grinding, Stress Relief, and Dicing - Kazuhisa Arai, Yoshikazu Kobayashi, Hideaki OtaniChapter 21: Packaging - Dietrich Tonnies, Michael TopperPart 4: Nanotechnology, MEMS, and FPDChapter 22: Nanotechnology and Nanomanufacturing - Zhong L. WangChapter 23: Fundamentals of Microelectromechanical Systems - Michael A. HuffChapter 24: Flat-Panel Display Technology and Manufacturing - David N. LiuPart 5: Gases and ChemicalsChapter 25: Specialty Gas and CDA Systems - Wayne D. CurcieChapter 26: Waste Gas Abatement Systems - Joseph D. SweeneyChapter 27: PFC Abatement - James C. CoxChapter 28: Chemical and Slurry Handling Systems - Kristin Cavicchi, Dan BarsnessChapter 29: Fluid Handling Components for High Purity Liquid Chemicals and Slurries - Charles K. GouldChapter 30: Fundamentals of Ultrapure Water - David J. AlbrechtPart 6: Fab Yield, Operations, and FacilitiesChapter 31: Yield Management - Bo Li, Wayne CarrikerChapter 32: Automated Material Handling System - Clint HarrisChapter 33: CD Metrology and CD-SEM - Ram Peltinov, Mina MenakerChapter 34: Six Sigma - Bruno Scibilia, Yoan DupretChapter 35: Advanced Process Control - Robert H. McCaffertyChapter 36: Environmental, Health, and Safety (EHS) Considerations in Semiconductor Fabrication Facilities - Brett J. Davis, Steven R. TrammellChapter 37: Plan, Design, and Construction of a FAB - Industrial Design and ConstructionChapter 38: Cleanroom Design and Construction - Richard V. Pavlotsky, Stephen C. BeckChapter 39: Micro-Vibration and Noise Design - Michael Gandreau, Hal AmickChapter 40: ESD Controls in Cleanroom Environments - Larry LevitChapter 41: Airborne Molecular Contamination - Chris MullerChapter 42: Particle Monitoring in Semiconductor Manufacturing - Steven Kochevar, Jerry GromalaChapter 43: Wastewater Neutralization Systems - Richard E. Pinkowski APPENDIXINDEX

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Hwaiyu Geng; Lin Zhou; Ilsun Park; K. V Ravi; Hazara S Rathore; Kaushik Chanda; L. P Ren; King N Tu; David J Coumou; Peter Biltoft; Charles Howard; Chris A Mack; Michael Graf; Peng Zhang; Shouliang Lai; Florian Solzbacher; Edward J McInerney; Jamal Ramdani; Giovanni Vaccari; Tom Ritzdorf; John Klocke; Timothy S Dyer; Andrew Machamer; Donald W Blair; Kazuhisa Arai; Yoshikazu Kobayashi; Hideaki Otani; Dietrich Tönnies; Michael Töpper; Zhong L Wang; Michael A Huff; David N Liu; Wayne D Curcie; Joseph D Sweeney; James C Cox; Kristin Cavicchi; Dan Barsness; Charles K Gould; David J Albrecht; Bo Li; Wayne Carriker; Clint Haris; Ram Peltinov; Mina Menaker; Bruno Scibilia; Yoan Dupret Altis; Robert H McCafferty; Brett J Davis; Steven R Trammell; Richard V Pavlotsky

McGraw-Hill School Education Group

Irwin Professional Publishing

Oracle Press

McGraw Hill LLC Professional Division, New York, 2005

McGraw-Hill's AccessEngineering, New York, 2000

McGraw-Hill handbooks, New York, cop. 2005

United States, United States of America

до 2011-08

lg608978

{"edition":"1","isbns":["0071445595","9780071445597"],"last_page":871,"publisher":"McGraw-Hill"}

Cover......Page 1
PART 1: SEMICONDUCTOR FUNDAMENTALS AND BASIC MATERIALS......Page 2
CHAPTER 1 HOW SEMICONDUCTOR CHIPS ARE MADE......Page 4
CHAPTER 2 IC DESIGN......Page 14
CHAPTER 3 SILICON SUBSTRATES FOR SEMICONDUCTOR MANUFACTURING......Page 22
CHAPTER 4 COPPER, LOW-k DIELECTRICS, AND THEIR RELIABILITY......Page 38
CHAPTER 5 FUNDAMENTALS OF SILICIDE FORMATION ON Si......Page 52
CHAPTER 6 PLASMA PROCESS CONTROL......Page 62
CHAPTER 7 VACUUM TECHNOLOGY......Page 80
CHAPTER 8 PHOTOMASK......Page 94
PART 2: WAFER PROCESSING......Page 102
CHAPTER 9 MICROLITHOGRAPHY......Page 104
CHAPTER 10 ION IMPLANTATION AND RAPID THERMAL PROCESSING......Page 128
CHAPTER 11 WET ETCHING......Page 144
CHAPTER 12 PLASMA ETCHING......Page 152
CHAPTER 13 PHYSICAL VAPOR DEPOSITION......Page 178
CHAPTER 14 CHEMICAL VAPOR DEPOSITION......Page 200
CHAPTER 15 EPITAXY......Page 216
CHAPTER 16 ECD FUNDAMENTALS......Page 234
CHAPTER 17 CHEMICAL MECHANICAL POLISHING......Page 246
CHAPTER 18 WET CLEANING......Page 260
PART 3: FINAL MANUFACTURING......Page 274
CHAPTER 19 INSPECTION, MEASUREMENT,AND TEST......Page 276
CHAPTER 20 GRINDING, STRESS RELIEF, AND DICING......Page 322
CHAPTER 21 PACKAGING......Page 344
PART 4: NANOTECHNOLOGY, MEMS, AND FPD......Page 398
CHAPTER 22 NANOTECHNOLOGY AND NANOMANUFACTURING......Page 400
CHAPTER 23 FUNDAMENTALS OF MICROELECTROMECHANICAL SYSTEMS......Page 412
CHAPTER 24 FLAT-PANEL DISPLAY TECHNOLOGY AND MANUFACTURING......Page 440
PART 5: GASES AND CHEMICALS......Page 454
CHAPTER 25 SPECIALTY GAS AND CDA SYSTEMS......Page 456
CHAPTER 26 WASTE GAS ABATEMENT SYSTEMS......Page 484
CHAPTER 27 PFC ABATEMENT......Page 502
CHAPTER 28 CHEMICAL AND SLURRY HANDLING SYSTEMS......Page 516
CHAPTER 29 FLUID HANDLING COMPONENTS FOR HIGH-PURITY LIQUID CHEMICALS AND SLURRIES......Page 538
CHAPTER 30 FUNDAMENTALS OF ULTRAPURE WATER......Page 560
PART 6: FAB YIELD, OPERATIONS, AND FACILITIES......Page 576
CHAPTER 31 YIELD MANAGEMENT......Page 578
CHAPTER 32 AUTOMATED MATERIAL HANDLING SYSTEM......Page 596
CHAPTER 33 CD METROLOGY AND CD-SEM......Page 608
CHAPTER 34 SIX SIGMA......Page 620
CHAPTER 35 ADVANCED PROCESS CONTROL......Page 636
CHAPTER 36 ENVIRONMENTAL, HEALTH, AND SAFETY CONSIDERATIONS IN SEMICONDUCTOR FABRICATION FACILITIES......Page 658
CHAPTER 37 PLAN, DESIGN, AND CONSTRUCTION OF A FAB......Page 676
CHAPTER 38 CLEANROOM DESIGN AND CONSTRUCTION......Page 702
CHAPTER 39 MICRO-VIBRATION AND NOISE DESIGN......Page 738
CHAPTER 40 ESD CONTROLS IN CLEANROOM ENVIRONMENTS......Page 772
CHAPTER 41 AIRBORNE MOLECULAR CONTAMINATION......Page 792
CHAPTER 42 PARTICLE MONITORING IN SEMICONDUCTOR MANUFACTURING......Page 816
CHAPTER 43 WASTEWATER NEUTRALIZATION SYSTEMS......Page 840

Annotation WORLD-CLASS SEMICONDUCTOR MANUFACTURING EXPERTISE AT YOUR FINGERTIPS This is a comprehensive reference to the semiconductor manufacturing process and ancillary facilities -- from raw material preparation to packaging and testing, applying basics to emerging technologies. Readers charged with optimizing the design and performance of manufacturing processes will find all the information necessary to produce the highest quality chips at the lowest price in the shortest time possible. The "Semiconductor Manufacturing Handbook provides leading-edge information on semiconductor wafer processes, MEMS, nanotechnology, and FPD, plus the latest manufacturing and automation technologies, including: Yield Management Automated Material Handling System Fab and Cleanroom Design and Operation Gas Abatement and Waste Treatment Management And much more Written by 60 international experts, and peer reviewed by a seasoned advisory board, this handbook covers the fundamentals of relevant technology and its real-life application and operational considerations for planning, implementing, and controlling manufacturing processes. It includes hundreds of detailed illustrations and a list of relevant books, technical papers, and websites for further research. This inclusive, wide-ranging coverage makes the "Semiconductor Manufacturing Handbook the most comprehensive single-volume reference ever published in the field. STATE-OF-THE-ART SEMICONDUCTOR TECHNOLOGIES AND MANUFACTURING PROCESSES: SEMICONDUCTOR FUNDAMENTALS How Chips Are Designed and Made * Substrates * Copper and Low-k Dielectrics * Silicide Formation * Plasma * Vacuum * Photomask WAFER PROCESSING TECHNOLOGIES Microlithography * IonImplantation * Etch * PVD/ALD * CVD * ECD * Epitaxy * CMP * Wet Cleaning FINAL MANUFACTURING Packaging * Grinding, Stress Relief, Dicing * Inspection, Measurement, and Testing NANOTECHNOLOGY, MEMS, AND FPD GAS AND C

Annotation This handbook will provide engineers with the principles, applications, and solutions needed to design and manage semiconductor manufacturing operations. Consolidating the many complex fields of semiconductor fundamentals and manufacturing into one volume by deploying a team of world class specialists, it allows the quick look up of specific manufacturing reference data across many subdisciplines

2011-08-31